學歷 (Education ) :
Ph.D Materials Science & Engineering, University of Illinois at Urbana-Champaign (UIUC)
M.S Materials Science & Engineering, Rutgers University
B.S Materials Science & Engineering, National Tsing-Hua University (NTHU)
主要經歷(Experience):
2019 - present 教授, 國立交通大學國際半導體產業學院
Professor, ICST, NCTU
2012 - 2019 經理, 台灣積體電路股份有限公司
Manager, TSMC
2006 - 2012 Staff Engineer, Northrop Grumman Aerospace System. Redondo Beach, CA, USA
2001 - 2006 R&D Engineer, Wireless Semiconductor Division, Agilent Technologies Inc., Santa Clara, CA and Fort Collins, CO, USA
(i.e. Avago Technologies/now Broadcom)
2000 - 2001 Sr. Process Engineer, Portland Technology Development, Intel Corporation, OR, USA
簡介(Introduction):
Chun-Hsiung Lin received his B.S. degree from Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan and his Ph.D. degree from Materials Science and Engineering, University of Illinois at Urbana-Champaign. He joined International College of Semiconductor Technology in NCTU in 2019. He was a manager in R&D organization of Taiwan Semiconductor Manufacturing Company (TSMC) worked on transistor research for the advanced logic technologies from 2012 to 2019. Prior to join TSMC, he has been in III-V compound semiconductor devices and MMICs developments for more than 10 years. From 2006 to 2012, he was a staff engineer in Microelectronic Center, Northrop Grumman Corporation, Redondo Beach, CA, where he worked on researches for advanced III-V devices. From 2001 to 2006, he was a R&D engineer in Agilent/Avago Technology (now Broadcom Inc.) worked on the developments of GaAs MMICs for applications in cellular phone and wireless communication.
專長(Expertise):
- Advanced III-V compound semiconductor and Silicon CMOS Devices
- Compound semiconductor device manufacturing and integration (GaAs, InP, Sb-based and GaN)
- Semiconductor process technology of advanced 3D Silicon CMOS devices (e.g. FinFET)